@article{Yao:2024:10.1002/adfm.202405235,
author = {Yao, C and Leahu, G and Holicky, M and Liu, S and Fenech-Salerno, B and Lai, MC and Larciprete, MC and Ducati, C and Divitini, G and Li, Voti R and Sibilia, C and Torrisi, F},
doi = {10.1002/adfm.202405235},
journal = {Advanced Functional Materials},
title = {Thermally conductive hexagonal boron nitride/polymer composites for efficient heat transport},
url = {http://dx.doi.org/10.1002/adfm.202405235},
year = {2024}
}

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TY  - JOUR
AB  - Commercial thermally conductive dielectric materials used in electronic packaging typically exhibit thermal conductivities (κ) ranging from 0.8 to 4.2 W m−1 K−1. Hexagonal boron nitride (h-BN) flakes are promising thermally conductive materials for the thermal management of next-generation electronics. These electrically insulating yet thermally conducting h-BN flakes can be incorporated as thermal fillers to impart high κ to polymer-based composites. A cellulose-based composite embedded with few-layer h-BN (FLh-BN) flakes, achieving a κ ≈ 21.7 W m−1 K−1, prepared using a cost-effective and scalable procedure is demonstrated. This value is >5 times higher than the κ observed in composites embedded with bulk h-BN (Bh-BN, κ ≈ 4.5 W m−1 K−1), indicating the benefits of the superior κ of FLh-BN on the κ of h-BN polymer composites. When applied as a paste for thermal interface material (TIM), the FLh-BN composite can reduce the maximum temperature (Tmax) by 24.5 °C of a heating pad at a power density (h) of 2.48 W cm−2 compared to Bh-BN composites at the same h-BN loading. The results provide an effective approach to improve the κ of cellulose-based thermal pastes for TIMs and demonstrate their viability for heat dissipation in integrated circuits (ICs) and high-power electronic devices.
AU  - Yao,C
AU  - Leahu,G
AU  - Holicky,M
AU  - Liu,S
AU  - Fenech-Salerno,B
AU  - Lai,MC
AU  - Larciprete,MC
AU  - Ducati,C
AU  - Divitini,G
AU  - Li,Voti R
AU  - Sibilia,C
AU  - Torrisi,F
DO  - 10.1002/adfm.202405235
PY  - 2024///
SN  - 1616-301X
TI  - Thermally conductive hexagonal boron nitride/polymer composites for efficient heat transport
T2  - Advanced Functional Materials
UR  - http://dx.doi.org/10.1002/adfm.202405235
UR  - https://onlinelibrary.wiley.com/doi/full/10.1002/adfm.202405235
UR  - http://hdl.handle.net/10044/1/112500
ER  - 

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