@article{Tam:2023:10.1080/15376494.2022.2088906,
author = {Tam, L-H and Wu, R and Minkeng, MAN and Jiang, J and Zhou, A and Hao, H and Yu, Z and Wu, C},
doi = {10.1080/15376494.2022.2088906},
journal = {Mechanics of Advanced Materials and Structures},
pages = {4052--4064},
title = {Understanding creep behavior of carbon fiber/epoxy interface via molecular dynamics simulation},
url = {http://dx.doi.org/10.1080/15376494.2022.2088906},
volume = {30},
year = {2023}
}

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TY  - JOUR
AB  - This work focuses on molecular creep behavior of carbon fiber/epoxy interface under sustained loads at different levels. Threshold stress and energy barrier for the onset of interfacial creep failure under peeling loads are found greater than those under shearing. Microstructural changes during creep show that the epoxy has a large and irreversible deformation under peeling loads, denoted as a yielding process in the peeling case. The yielding process in the peeling case dissipates the applied energy in the epoxy structure. Therefore, the interface shows a stronger resistance to the peeling and the shearing is more critical during composite failure.
AU  - Tam,L-H
AU  - Wu,R
AU  - Minkeng,MAN
AU  - Jiang,J
AU  - Zhou,A
AU  - Hao,H
AU  - Yu,Z
AU  - Wu,C
DO  - 10.1080/15376494.2022.2088906
EP  - 4064
PY  - 2023///
SN  - 1075-9417
SP  - 4052
TI  - Understanding creep behavior of carbon fiber/epoxy interface via molecular dynamics simulation
T2  - Mechanics of Advanced Materials and Structures
UR  - http://dx.doi.org/10.1080/15376494.2022.2088906
UR  - https://www.webofscience.com/api/gateway?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000815830200001&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=a2bf6146997ec60c407a63945d4e92bb
UR  - https://www.tandfonline.com/doi/full/10.1080/15376494.2022.2088906
VL  - 30
ER  - 

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