@article{DEWEN:1991:10.1163/156856191X00558,
author = {DEWEN, PN and PIALUCHA, TP and CAWLEY, P},
doi = {10.1163/156856191X00558},
journal = {JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY},
pages = {667--689},
title = {IMPROVING THE RESOLUTION OF ULTRASONIC ECHOES FROM THIN BONDLINES USING CEPSTRAL PROCESSING},
url = {http://dx.doi.org/10.1163/156856191X00558},
volume = {5},
year = {1991}
}

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TY  - JOUR
AU  - DEWEN,PN
AU  - PIALUCHA,TP
AU  - CAWLEY,P
DO  - 10.1163/156856191X00558
EP  - 689
PY  - 1991///
SN  - 0169-4243
SP  - 667
TI  - IMPROVING THE RESOLUTION OF ULTRASONIC ECHOES FROM THIN BONDLINES USING CEPSTRAL PROCESSING
T2  - JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
UR  - http://dx.doi.org/10.1163/156856191X00558
UR  - https://www.webofscience.com/api/gateway?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:A1991GD56800007&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=a2bf6146997ec60c407a63945d4e92bb
VL  - 5
ER  - 

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